Electronic component placement optimization for heat measures of smartglasses

The thermal aware floor planning for VLSIs and placement optimization of electronic components on printed circuit boards (PCBs) using genetic algorithms (GAs) are well studied. However, there no technical paper component considering the heat smartglasses. In this paper, we propose a method optimizing equipped smartglasses elitist non-dominated sorting algorithm (NSGA-II) resistance circuit. Electronic that have various dimensions power consumptions relocated to minimize maximum temperature parts around ears areas often held by hands simultaneously. experimental results show proposed effectively reduced temperatures.